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Title of Article

THE INFLUENCE OF INTERMOLECULAR HYDROGEN BONDS ON PHOTORESIST MASK PROPERTIES


Issue
4
Date
2014

Article type
scientific article
UDC
776.3.665.225+541.14
Pages
178-182
Keywords
photoresist, improvement of photoresist properties, hydrogen bond, additives to photoresist, photolithography, resolution


Authors
Lebedev V.I.
Nizhegorodskiy gosuniversitet im. N.I. Lobachevskogo

Kotomina V.E.
Nauchno-issledovatelskiy fiziko-tekhnicheskiyinstitut NNGU im. N.I. Lobachevskogo

Zelentsov S.V.
Nizhegorodskiy gosuniversitet im. N.I. Lobachevskogo

Leonov E.C.
Nizhegorodskiy gosuniversitet im. N.I. Lobachevskogo

Sidorenko K.V.
Nauchno-issledovatelskiy fiziko-tekhnicheskiyinstitut NNGU im. N.I. Lobachevskogo


Abstract
The influence of additives having an ability to form hydrogen bonds with the photosensitive compound on the photoresist mask properties was investigated. Enhancement of photoresist resolution has been achieved by adding the compound. IR spectroscopy methods were used to understand the physical and chemical mechanism of the influence. An experimental confirmation of interrelation between the hydrogen bond density and the resolution of the photoresist was obtained.

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