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Title of Article

GLUER DYNAMICS AT POLISHING DIELECTRIC WAFERS


Issue
4
Date
 2014

Article type
 scientific article
UDC
534.014
Pages
339-342
Keywords
 grinding, polishing, friction, mathematical model, gluer, polisher


Authors
Gavrischuk E.M.
Institut khimii vysokochistykhveschestvim. G.G. Devyatykh RAN, N. Novgorod

Komarov V.N.
Nizhegorodskiy gosuniversitet im. N.I. Lobachevskogo

Metrikin V.S.
NIIprikladnoymatematikiikibernetiki Nizhegorodskogo gosuniversiteta im. N.I. Lobachevskogo

Panasenko A.G.
Nizhegorodskiy gosuniversitet im. N.I. Lobachevskogo


Abstract
The article studies a possibility to regulate the process of relative material removal from wafers by adjusting grinder geometries. The values of geometric and dynamic parameters are given for which the motion regimes with halts of the gluer arise.

File (in Russian)

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